Antistatischer Schaumstoff für Display-Abstandshalter

Huzhou Meishuo provides anti-static PE foam Electronic packaging foam material, including PE foam, which meets all the electronic packaging material requirement on surface resistivity, reach 10^3 to 10^11 Ω.

Material Safety Data Sheet (MSDS)

ESD application scenarios and special performance indicators, parameter requirements, and processes involved in the application scenario for this product:

1. Chip packaging lining (anti-static)

Physical Properties:
Performance ParameterTypical Value/RangeTest StandardChip Packaging Adaptability Description
Density60-120 kg/m³ISO 845High density (≥80kg/m³) enhances compressive resistance
Dicke0.5-5.0 mmASTM D3741-2mm commonly used for chip trays; 3-5mm for shipping boxes
Surface Resistance10⁶~10⁹ ΩANSI/ESD S11.11Electrostatic dissipation zone (prevents static accumulation)
Volume Resistance10³~10⁶ Ω·cmASTM D257Uniform conductivity to prevent localized discharges
Zugfestigkeit1.5-3.5 MPaISO 527Prevents tearing during handling
Compression Set≤10% (50% compression, 22h)ISO 1856Excellent recovery after long-term compression
Temperature Resistance-50℃~+105℃ASTM D746Withstands chip reflow temperatures (125℃ short-term)
CleanlinessNAS 1638 Class 5IEST-STD-CC1246DNo particle shedding to protect chip surfaces
VOC EmissionTVOC ≤50μg/m³GB/T 29899Avoids contamination of chip bonding areas
Environmental FriendlinessHalogen-free, RoHS/REACH compliantIEC 62321Meets electronics industry environmental standards
Manufacturing Process: Bonding
2. Medical imaging equipment (MRI equipment)

Physical Properties:
Performance ParameterTypical Value/RangeTest StandardMedical Device Adaptability Description
Density80-150 kg/m³ISO 845High density (≥100kg/m³) ensures structural stability
Dicke3-20 mmASTM D374Commonly 10-15mm for MRI device gaskets
Surface Resistance10⁶~10⁹ ΩANSI/ESD S11.11Electrostatic dissipation to prevent interference with precision sensors
Volume Resistance10³~10⁶ Ω·cmASTM D257Uniform conductivity to avoid localized discharges
Zugfestigkeit2.0-4.0 MPaISO 527Resistant to mechanical stress, prevents tearing
Compression Set≤8% (50% compression, 22h)ISO 1856No deformation after long-term use
Temperature Resistance-60℃~+120℃ASTM D746Suitable for MRI liquid nitrogen cooling environments
Shielding Effectiveness≥30dB (1GHz)ASTM D4935Suppresses electromagnetic interference (EMI)
BiocompatibilityISO 10993-5/10USP Class VINon-cytotoxic/non-skin irritating
CleanlinessISO 14644-1 Class 5IEST-STD-CC1246DNo particle shedding, meets cleanroom requirements

Manufacturing Process: Bonding (Conductive Modification)
3. Conductive buffer pads between battery modules

Physical Properties:
Performance IndicatorTypical Value/RangeTest Standard
Density30-120 kg/m³ (45-80 commonly used)ISO 845
Dicke0.5-10 mm (2-5 mm commonly used)ISO 9073-2
Surface Resistance10⁶-10⁹ Ω/sq (ESD grade)ASTM D257
Volume Resistance10⁶-10⁹ Ω·cmASTM D257
Compressive Strength10-50 kPa (25% compressive deformation)ISO 3386
Rebound Rate≥70%ASTM D3574
Flame RetardancyUL94 HF-1/V0 (optional)UL 94
Temperature Resistance Range-40℃ ~ +120℃ (150℃ for short-term)ISO 6722
Wärmeleitfähigkeit0.04-0.06 W/(m·K)ASTM C518
Wasserabsorption<1% (24h immersion)ASTM D570
Tear Strength3-10 N/mmASTM D624
Manufacturing Process: Bonding
4. Internal parts and components of aerospace satellites

Physical Properties:

Performance IndicatorTypical Value/RangeTest StandardSpecial Aerospace Requirements
Density60-150 kg/m³ (80-120 commonly used)ISO 845High density ensures impact resistance and structural stability
Dicke0.2-15 mm (1-5 mm commonly used)ISO 9073-2Ultra-thin (<1mm) for precision instrument gaps
Surface Resistance10⁴-10⁹ Ω/sq (more stringent control)ASTM D257Need to prevent electromagnetic interference (EMI shielding optional)
Volume Resistance10⁴-10⁹ Ω·cmASTM D257Higher stability requirements in low-humidity environments
Compressive Strength50-200 kPa (25% compressive deformation)ISO 3386Must withstand high-frequency vibrations and G-force impacts
Rebound Rate≥85%ASTM D3574More stringent requirements for recovery after long-term compression
Flame RetardancyUL94 V0 / FAR 25.853UL 94 / FAA standardsMust pass toxic fume test (low toxicity)
Temperature Resistance Range-70℃ ~ +180℃ (200℃ for short-term)RTCA DO-160Compatible with extreme cold (high altitude) and re-entry high temperatures
Vacuum OutgassingTML<1%, CVCM<0.1%ASTM E595Prevent contamination of spacecraft optical components
Radiation ResistanceResistant to UV/γ rays (no cracking for 1000 hours)MIL-STD-810GEssential for satellites and deep-space equipment
Wärmeleitfähigkeit0.03-0.05 W/(m·K)ASTM C518Thermally enhanced types required for some scenarios
Chemical ResistanceResistant to hydraulic oil, rocket fuel oxidantsASTM D471Resist hydrazines, nitrogen tetroxide, etc.

Manufacturing Processes: Die cutting, bonding, etc.