ESD PE-Schaum

ESD-PE-Schaum ist eine Art antistatischer, geschlossenzelliger Polyethylenschaum in schwarzer Farbe. Es handelt sich um einen umweltfreundlichen, elektrostatisch schützenden Industrieschaum mit geringer Dichte für die Verpackungsindustrie. Als Schaum Oberfläche Widerstand Unterschied, hat es antistatische PE-Schaum und leitfähigem PE-Schaum zwei Arten. Antistatischer PE-Schaum hat einen Oberflächen- oder Volumenwiderstand von 10^6-109 Ω, und leitfähiger PE-Schaum hat einen Oberflächenwiderstand oder Volumenwiderstand von 103-105Ω. 

Material Safety Data Sheet (MSDS)

ESD application scenarios and special performance indicators, parameter requirements, and processes involved in the application scenario for this product:

1. Chip packaging lining (anti-static)

Physical Properties:
Performance ParameterTypical Value/RangeTest StandardChip Packaging Adaptability Description
Density60-120 kg/m³ISO 845High density (≥80kg/m³) enhances compressive resistance
Dicke0.5-5.0 mmASTM D3741-2mm commonly used for chip trays; 3-5mm for shipping boxes
Surface Resistance10⁶~10⁹ ΩANSI/ESD S11.11Electrostatic dissipation zone (prevents static accumulation)
Volume Resistance10³~10⁶ Ω·cmASTM D257Uniform conductivity to prevent localized discharges
Zugfestigkeit1.5-3.5 MPaISO 527Prevents tearing during handling
Compression Set≤10% (50% compression, 22h)ISO 1856Excellent recovery after long-term compression
Temperature Resistance-50℃~+105℃ASTM D746Withstands chip reflow temperatures (125℃ short-term)
CleanlinessNAS 1638 Class 5IEST-STD-CC1246DNo particle shedding to protect chip surfaces
VOC EmissionTVOC ≤50μg/m³GB/T 29899Avoids contamination of chip bonding areas
Environmental FriendlinessHalogen-free, RoHS/REACH compliantIEC 62321Meets electronics industry environmental standards
Manufacturing Process: Bonding
2. Medical imaging equipment (MRI equipment)

Physical Properties:
Performance ParameterTypical Value/RangeTest StandardMedical Device Adaptability Description
Density80-150 kg/m³ISO 845High density (≥100kg/m³) ensures structural stability
Dicke3-20 mmASTM D374Commonly 10-15mm for MRI device gaskets
Surface Resistance10⁶~10⁹ ΩANSI/ESD S11.11Electrostatic dissipation to prevent interference with precision sensors
Volume Resistance10³~10⁶ Ω·cmASTM D257Uniform conductivity to avoid localized discharges
Zugfestigkeit2.0-4.0 MPaISO 527Resistant to mechanical stress, prevents tearing
Compression Set≤8% (50% compression, 22h)ISO 1856No deformation after long-term use
Temperature Resistance-60℃~+120℃ASTM D746Suitable for MRI liquid nitrogen cooling environments
Shielding Effectiveness≥30dB (1GHz)ASTM D4935Suppresses electromagnetic interference (EMI)
BiocompatibilityISO 10993-5/10USP Class VINon-cytotoxic/non-skin irritating
CleanlinessISO 14644-1 Class 5IEST-STD-CC1246DNo particle shedding, meets cleanroom requirements

 

Manufacturing Process: Bonding (Conductive Modification)
3. Conductive buffer pads between battery modules

Physical Properties:
Performance IndicatorTypical Value/RangeTest Standard
Density30-120 kg/m³ (45-80 commonly used)ISO 845
Dicke0.5-10 mm (2-5 mm commonly used)ISO 9073-2
Surface Resistance10⁶-10⁹ Ω/sq (ESD grade)ASTM D257
Volume Resistance10⁶-10⁹ Ω·cmASTM D257
Compressive Strength10-50 kPa (25% compressive deformation)ISO 3386
Rebound Rate≥70%ASTM D3574
Flame RetardancyUL94 HF-1/V0 (optional)UL 94
Temperature Resistance Range-40℃ ~ +120℃ (150℃ for short-term)ISO 6722
Wärmeleitfähigkeit0.04-0.06 W/(m·K)ASTM C518
Wasserabsorption<1% (24h immersion)ASTM D570
Tear Strength3-10 N/mmASTM D624
Manufacturing Process: Bonding
4. Internal parts and components of aerospace satellites

Physical Properties:

 

Performance IndicatorTypical Value/RangeTest StandardSpecial Aerospace Requirements
Density60-150 kg/m³ (80-120 commonly used)ISO 845High density ensures impact resistance and structural stability
Dicke0.2-15 mm (1-5 mm commonly used)ISO 9073-2Ultra-thin (<1mm) for precision instrument gaps
Surface Resistance10⁴-10⁹ Ω/sq (more stringent control)ASTM D257Need to prevent electromagnetic interference (EMI shielding optional)
Volume Resistance10⁴-10⁹ Ω·cmASTM D257Higher stability requirements in low-humidity environments
Compressive Strength50-200 kPa (25% compressive deformation)ISO 3386Must withstand high-frequency vibrations and G-force impacts
Rebound Rate≥85%ASTM D3574More stringent requirements for recovery after long-term compression
Flame RetardancyUL94 V0 / FAR 25.853UL 94 / FAA standardsMust pass toxic fume test (low toxicity)
Temperature Resistance Range-70℃ ~ +180℃ (200℃ for short-term)RTCA DO-160Compatible with extreme cold (high altitude) and re-entry high temperatures
Vacuum OutgassingTML<1%, CVCM<0.1%ASTM E595Prevent contamination of spacecraft optical components
Radiation ResistanceResistant to UV/γ rays (no cracking for 1000 hours)MIL-STD-810GEssential for satellites and deep-space equipment
Wärmeleitfähigkeit0.03-0.05 W/(m·K)ASTM C518Thermally enhanced types required for some scenarios
Chemical ResistanceResistant to hydraulic oil, rocket fuel oxidantsASTM D471Resist hydrazines, nitrogen tetroxide, etc.

 

Manufacturing Processes: Die cutting, bonding, etc.